Do you Know What is Surface Mount Technology (SMT)？

SMT is a surface assembly technology known as surface mount or surface mount technology.

Depending on the SMT process

SMT is divided into dispensing process (wave soldering) and solder paste process (reflow soldering).

Solder paste process requires reflow furnace function, is a pin-free or short-lead surface assembly components, referred to as SMC/SMD, Chinese called components, installed on the printed circuit board, PCB surface or other substrate surface, through reflow welding or dip welding and other methods to weld the circuit assembly technology.

Dispensing process SMT red glue is a kind of poly compound, different from solder paste is that it is cured after heat, its freezing point temperature is 150℃, at this time, the red glue begins to change from paste to solid directly. SMT red glue has viscosity fluidity, temperature characteristics, wetting characteristics and so on. According to this characteristic of red glue, in the production, the aim of using red glue is to make the parts firmly stick to the surface of the PCB to avoid falling. It needs to be fixed by reflow furnace and also needs to be welded by soldering.

According to the SMT process

It can be divided into the following types: an assembly using only surface mount components, single-sided assembly with surface mount; The second type of assembly adopts a surface mount reason on one side and a combination of surface mount reason and perforated reason on the other side; The third type adopts perforated reasons on the top surface and surface-mount reasons on the bottom surface.

I believe that through Yangling Electronics to explain the relevant knowledge of surface mount technology, everybody has a certain understanding of SMT, if you are interested in our products, please contact Nancy.

Some information comes from the internet, if there is infringement, please contact us at 13580828702.