Do you know how to reduce the problem of poor solder paste printing in smt pick and place machine processing?

 A key step in SMT pick and place machine processing is tin printing, which has an important impact on the subsequent welding quality. To solve the problem of poor tin printing, the pick and place factory usually adopts the following measures:

Strict control of solder paste quality: use good quality tin, and ensure that tin is not contaminated during storage and use, and maintain a good slurry state.

Accurate machine calibration: The press is calibrated regularly to ensure the accuracy and repeatability of tin printing

Optimize printing parameters: Adjust the parameters of scraper pressure, printing speed, printing gap, etc., to adapt to different PCB board and tinning needs.

The use of high-precision steel mesh: the use of high-precision steel mesh that matches the precision of the hole position of the PCB board reduces the probability of bad printing

Regular inspection and cleaning: keep the steel mesh and scraper clean, remove the blockage in time to avoid causing printing defects.

Operator training: Operators are regularly trained to ensure they understand and adhere to correct operating procedures and printing techniques.

Through the above concentrated measures, the occurrence of poor tin printing can be greatly reduced and the overall SMT processing quality can be improved.

The above is the problem of poor solder paste printing encountered by the smt pick and place machine processing told by Yangling Electronics. 

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