What is SMT?(八) -- Reflow soldering common knowledge Ⅲ
author: Hellen
2022-09-22
47. the PCB of the computer used, its material is: glass fiber board;
48. SMT parts packaging its tape tray diameter of 13 inches, 7 inches;
49. SMT general steel plate openings than the PCB PAD 4um smaller to prevent the phenomenon of poor tin ball;
50. according to the "PCBA inspection specification" when the two-sided angle > 90 degrees means that the solder paste and wave solder body no adhesion;
51. IC unpacking humidity display card humidity in the case of more than 30% means that the IC moisture and moisture absorption;
52. The correct weight ratio and volume ratio of solder powder to flux in solder paste composition is 90%:10%, 50%:50%;
53. early surface mount technology originated in the mid-1960s in military and aerospace electronics;
54. the most commonly used SMT solder paste Sn and Pb content are: 63Sn 37Pb; eutectic point is 183°C
55. the common bandwidth of 8mm paper tape reel feed pitch is 4mm. 56;
56. In the early 1970s, a new type of SMD emerged in the industry as a "sealed footless chip carrier", often replaced by the LCC;
57. The resistance value of the component with the symbol 272 should be 2.7K ohms. 58;
58. 100NF components have the same capacitance as 0.10uf. 60;
60. The most used material for electronic parts in SMT is ceramic;
61. The temperature curve of the reflow oven with a maximum temperature of 215C is the most suitable;
62. tin furnace inspection, the temperature of the tin furnace 245 ℃ is more appropriate;
63. the steel plate opening type square, triangle, round, star, Ben Lei shape;
64. SMT section of the row of resistance there is no directional no. 65;
65. The sold solder paste on the market, the actual only 4 hours of sticky time;
66. SMT equipment generally use the rated air pressure of 5KG/cm2;
67. SMT parts maintenance tools are: soldering iron, hot air extractor, suction tin gun, tweezers;
68. QC is divided into: IQC, IPQC, FQC, OQC;
69 high-speed placement machine can be mounted resistors, capacitors, IC, transistors; packaging for Reel, Tray two, Tube is not suitable for high-speed placement machine;
70. the characteristics of static electricity: small current, affected by humidity;
71. front PTH, reverse SMT over the tin furnace when using what kind of welding method scrambled double-wave welding;
72. SMT common inspection methods: visual inspection, X-ray inspection, machine vision inspection, AOI optical instrument inspection;
73. chromium iron repair parts heat transfer method is conduction convection;
74. the main composition of the BGA material tin ball Sn90 Pb10, SAC305, SAC405;
75. steel plate production methods laser cutting, electroforming, chemical etching;
76. the temperature of the furnace according to: using the thermometer to measure the applicable temperature;
77. the SMT semi-finished products are exported in the soldering condition when the parts are fixed on the PCB;
78. the development of modern quality management history TQC-TQA-TQM;
79. ICT test is a needle bed test. 80;
80. ICT testing can test electronic parts using static testing. 81;
81. solder characteristics are lower melting point than other metals, physical properties to meet the welding conditions, low temperature fluidity than other metals;
82. the very soldering furnace parts change process conditions to change to re-measure the measurement curve;
83. Siemens 80F / S belongs to the more electronic control drive;
84. solder paste thickness meter is the use of Laser light measurement: solder paste degree, solder paste thickness, solder paste printed out of the width;
85. SMT parts feeding methods are vibration feeder, tray feeder, tape feeder;
86. SMT equipment using which mechanism: cam mechanism, side bar mechanism, screw mechanism, sliding mechanism;
48. SMT parts packaging its tape tray diameter of 13 inches, 7 inches;
49. SMT general steel plate openings than the PCB PAD 4um smaller to prevent the phenomenon of poor tin ball;
50. according to the "PCBA inspection specification" when the two-sided angle > 90 degrees means that the solder paste and wave solder body no adhesion;
51. IC unpacking humidity display card humidity in the case of more than 30% means that the IC moisture and moisture absorption;
52. The correct weight ratio and volume ratio of solder powder to flux in solder paste composition is 90%:10%, 50%:50%;
53. early surface mount technology originated in the mid-1960s in military and aerospace electronics;
54. the most commonly used SMT solder paste Sn and Pb content are: 63Sn 37Pb; eutectic point is 183°C
55. the common bandwidth of 8mm paper tape reel feed pitch is 4mm. 56;
56. In the early 1970s, a new type of SMD emerged in the industry as a "sealed footless chip carrier", often replaced by the LCC;
57. The resistance value of the component with the symbol 272 should be 2.7K ohms. 58;
58. 100NF components have the same capacitance as 0.10uf. 60;
60. The most used material for electronic parts in SMT is ceramic;
61. The temperature curve of the reflow oven with a maximum temperature of 215C is the most suitable;
62. tin furnace inspection, the temperature of the tin furnace 245 ℃ is more appropriate;
63. the steel plate opening type square, triangle, round, star, Ben Lei shape;
64. SMT section of the row of resistance there is no directional no. 65;
65. The sold solder paste on the market, the actual only 4 hours of sticky time;
66. SMT equipment generally use the rated air pressure of 5KG/cm2;
67. SMT parts maintenance tools are: soldering iron, hot air extractor, suction tin gun, tweezers;
68. QC is divided into: IQC, IPQC, FQC, OQC;
69 high-speed placement machine can be mounted resistors, capacitors, IC, transistors; packaging for Reel, Tray two, Tube is not suitable for high-speed placement machine;
70. the characteristics of static electricity: small current, affected by humidity;
71. front PTH, reverse SMT over the tin furnace when using what kind of welding method scrambled double-wave welding;
72. SMT common inspection methods: visual inspection, X-ray inspection, machine vision inspection, AOI optical instrument inspection;
73. chromium iron repair parts heat transfer method is conduction convection;
74. the main composition of the BGA material tin ball Sn90 Pb10, SAC305, SAC405;
75. steel plate production methods laser cutting, electroforming, chemical etching;
76. the temperature of the furnace according to: using the thermometer to measure the applicable temperature;
77. the SMT semi-finished products are exported in the soldering condition when the parts are fixed on the PCB;
78. the development of modern quality management history TQC-TQA-TQM;
79. ICT test is a needle bed test. 80;
80. ICT testing can test electronic parts using static testing. 81;
81. solder characteristics are lower melting point than other metals, physical properties to meet the welding conditions, low temperature fluidity than other metals;
82. the very soldering furnace parts change process conditions to change to re-measure the measurement curve;
83. Siemens 80F / S belongs to the more electronic control drive;
84. solder paste thickness meter is the use of Laser light measurement: solder paste degree, solder paste thickness, solder paste printed out of the width;
85. SMT parts feeding methods are vibration feeder, tray feeder, tape feeder;
86. SMT equipment using which mechanism: cam mechanism, side bar mechanism, screw mechanism, sliding mechanism;
What is SMT?(九) -- Reflow soldering common knowledge IV
What is SMT?(七) -- Reflow soldering common knowledge Ⅱ
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