What is SMT?(六) -- Reflow soldering common knowledge Ⅰ
author: Hellen
2022-09-19
1. Generally speaking, the temperature of SMT workshop is 23±7℃;
2. solder paste printing, the materials and tools needed to prepare: solder paste, steel plate, scraper, wipe paper, dust-free paper, cleaning agent, stirring knife;
3. the general composition of commonly used solder paste is Sn96.5% / Ag3% / Cu0.5%. 4;
4. the main components of the solder paste is divided into two major components tin powder and flux. 5;
5. the main role of flux in soldering is to remove the oxide, destroy the surface tension of molten tin, to prevent re-oxidation. 6;
6. the volume ratio of tin powder particles to Flux (flux) in the solder paste is about 1:1, and the weight ratio is about 9:1;
7. the principle of taking the solder paste is first in first out;
8. When the paste is opened and used, it must go through two important processes: tempering and stirring;
9. The common production methods of steel plate are: etching, laser, electroforming;
10. The full name of SMT is Surface mount (or mounting) technology, the Chinese meaning is surface adhesion (or mounting) technology;
11. The full name of ESD is Electro-static discharge, meaning electrostatic discharge in Chinese;
12. when making SMT equipment program, the program includes five major parts, this five parts for PCB data; Mark data; Feeder data; Nozzle data; Part data;
13. lead-free solder Sn/Ag/Cu 96.5/3.0/0.5 melting point of 217C;
14. The controlled relative temperature and humidity of the parts drying oven is <10%;
15. commonly used passive components (PassiveDevices) are: resistors, capacitors, inductors (or diodes), etc.; active components (ActiveDevices) are: crystals, IC, etc.;
16. Commonly used SMT steel plate material is stainless steel;
17. The thickness of the commonly used SMT steel plate is 0.15mm (or 0.12mm);
18. The types of electrostatic charge generated by friction, separation, induction, electrostatic conduction, etc.; electrostatic charge on the electronics industry: ESD failure, electrostatic pollution; electrostatic elimination of the three principles of electrostatic neutralization, grounding, shielding;
19. imperial size LxW 0603=0.06inch*0.03inch, metric size LxW 3216=3.2mm*1.6mm;
20. drain resistance ERB-05604-J81 code 8 "4" for 4 circuits, resistance value of 56 ohms. Capacitor ECA-0105Y-M31 capacitance C = 106PF = 1NF = 1X10-6F. 21;
21. ECN Chinese full name: engineering change notice; SWR Chinese full name: special requirements work order, must be countersigned by the relevant departments, the documentation center distribution, in order to be effective;
22. 5S specific content for the organization, tidying, cleaning, cleaning, quality;
23. The purpose of PCB vacuum packaging is to prevent dust and moisture;
24. Quality policy is: comprehensive quality control, implementation of the system, to provide the quality of customer needs; full participation, timely processing, to achieve the goal of zero defects;
25. Quality three no policy is: do not accept bad products, do not manufacture bad products, do not flow out bad products;
26. QC seven techniques are the checklist, layer method, Plato, cause and effect diagram, scatter diagram, histogram, control chart;
27. The composition of the solder paste contains: metal powder, solvent, flux, anti-drop agent, active agent; by weight, the metal powder accounts for 85-92%, by volume, the metal powder accounts for 50%;
28. Solder paste must be taken out of the refrigerator when using back to temperature, the purpose is: let the refrigerated solder paste temperature back to room temperature, in order to facilitate printing. If not back to temperature in the PCBA into the Reflow easy to produce bad for tin beads;
29. the machine file supply mode are: ready mode, priority exchange mode, exchange mode and quick connect mode;
30. SMT PCB positioning methods are: vacuum positioning, mechanical hole positioning, bilateral clamping positioning and board edge positioning;
31. The resistor with a silkscreen (symbol) of 272 has a resistance of 2700Ω, and the resistor with a resistance of 4.8MΩ has a symbol (silkscreen) of 485;
2. solder paste printing, the materials and tools needed to prepare: solder paste, steel plate, scraper, wipe paper, dust-free paper, cleaning agent, stirring knife;
3. the general composition of commonly used solder paste is Sn96.5% / Ag3% / Cu0.5%. 4;
4. the main components of the solder paste is divided into two major components tin powder and flux. 5;
5. the main role of flux in soldering is to remove the oxide, destroy the surface tension of molten tin, to prevent re-oxidation. 6;
6. the volume ratio of tin powder particles to Flux (flux) in the solder paste is about 1:1, and the weight ratio is about 9:1;
7. the principle of taking the solder paste is first in first out;
8. When the paste is opened and used, it must go through two important processes: tempering and stirring;
9. The common production methods of steel plate are: etching, laser, electroforming;
10. The full name of SMT is Surface mount (or mounting) technology, the Chinese meaning is surface adhesion (or mounting) technology;
11. The full name of ESD is Electro-static discharge, meaning electrostatic discharge in Chinese;
12. when making SMT equipment program, the program includes five major parts, this five parts for PCB data; Mark data; Feeder data; Nozzle data; Part data;
13. lead-free solder Sn/Ag/Cu 96.5/3.0/0.5 melting point of 217C;
14. The controlled relative temperature and humidity of the parts drying oven is <10%;
15. commonly used passive components (PassiveDevices) are: resistors, capacitors, inductors (or diodes), etc.; active components (ActiveDevices) are: crystals, IC, etc.;
16. Commonly used SMT steel plate material is stainless steel;
17. The thickness of the commonly used SMT steel plate is 0.15mm (or 0.12mm);
18. The types of electrostatic charge generated by friction, separation, induction, electrostatic conduction, etc.; electrostatic charge on the electronics industry: ESD failure, electrostatic pollution; electrostatic elimination of the three principles of electrostatic neutralization, grounding, shielding;
19. imperial size LxW 0603=0.06inch*0.03inch, metric size LxW 3216=3.2mm*1.6mm;
20. drain resistance ERB-05604-J81 code 8 "4" for 4 circuits, resistance value of 56 ohms. Capacitor ECA-0105Y-M31 capacitance C = 106PF = 1NF = 1X10-6F. 21;
21. ECN Chinese full name: engineering change notice; SWR Chinese full name: special requirements work order, must be countersigned by the relevant departments, the documentation center distribution, in order to be effective;
22. 5S specific content for the organization, tidying, cleaning, cleaning, quality;
23. The purpose of PCB vacuum packaging is to prevent dust and moisture;
24. Quality policy is: comprehensive quality control, implementation of the system, to provide the quality of customer needs; full participation, timely processing, to achieve the goal of zero defects;
25. Quality three no policy is: do not accept bad products, do not manufacture bad products, do not flow out bad products;
26. QC seven techniques are the checklist, layer method, Plato, cause and effect diagram, scatter diagram, histogram, control chart;
27. The composition of the solder paste contains: metal powder, solvent, flux, anti-drop agent, active agent; by weight, the metal powder accounts for 85-92%, by volume, the metal powder accounts for 50%;
28. Solder paste must be taken out of the refrigerator when using back to temperature, the purpose is: let the refrigerated solder paste temperature back to room temperature, in order to facilitate printing. If not back to temperature in the PCBA into the Reflow easy to produce bad for tin beads;
29. the machine file supply mode are: ready mode, priority exchange mode, exchange mode and quick connect mode;
30. SMT PCB positioning methods are: vacuum positioning, mechanical hole positioning, bilateral clamping positioning and board edge positioning;
31. The resistor with a silkscreen (symbol) of 272 has a resistance of 2700Ω, and the resistor with a resistance of 4.8MΩ has a symbol (silkscreen) of 485;
What is SMT?(七) -- Reflow soldering common knowledge Ⅱ
What is SMT?(五) -- Reflow soldering
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