Do You Know Difference between ASM High Speed Mounter Machine and Siemens Medium Speed Placement Machine?

Siplace SMT machine is a core equipment in the SMT production line, mainly used for the installation of electronic products source chip components. However, ASM SMT machine due to the speed of different and different mount products, it can be mainly divided into ultra-high-speed SMT machine, high-speed SMT machine, medium speed SMT machine, etc., the following to talk about the Siplace high-speed SMT machine and Siplace medium speed SMT machine distinction.

1.Distinguish from the machine structure of the placement machine

Most of the medium speed mounters on the market use arch structure, relatively simple structure, poor mounting accuracy, small footprint, low requirements for the environment, the structure of the high-speed mounters more commonly used turret structure is also more composite structure, can meet the precision of micro-chip component mounting to achieve high-speed mounting.

2.According to the mounting speed of the SMT machine

The theoretical mounting speed of the medium speed mounting machine on the market is generally about 30,000 "pieces /h (chip components); the theoretical mounting speed of the high speed mounting machine is generally 30,000 ~ 60,000 pieces /h per hour (this mainly refers to the mounting of chip components below 0603 as the standard).

3.Distinguish from the placement machine mount products:

Medium speed mounter can be used to mount large components, high-precision components and special-shaped components, but also can mount small chip components; High speed SMT machine can be used to mount small chip components and small integrated components.

4. Distinguish from the scope of application of the SMT machine:

The medium speed SMT machine is widely used in some small and medium-sized electronic production and processing enterprises, research and development design centers and production enterprises with multi-variety and small-batch products. High-speed SMT machines are mainly used in large electronic manufacturing enterprises and some professional original equipment manufacturing enterprises (OEM).

In general, the high speed mounter is used to mount HIP components (that is, resistors and capacitors) and small three tubes. The pursuit of mounting speed, the mounting speed is much faster, and the universal mounting machine is used to mount special-shaped components with high pin density, such as IC, SOP, QFP, BGA and so on. The universal chip mounter can mount the components mounted by the high-speed chip mounter, but the high-speed chip mounter cannot mount the special-shaped components with high pin density. The main structure of the high speed placement machine is the turret type, and the main structure of the universal placement machine is the arch type. Usually, large-scale smt chip processing is to use these two kinds of chip machines together. If the production volume is not large, you can only buy a general placement machine to use.

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