2D/3D Solder Paste Inspection System in SMT Production Line
Brief introduction
Solder paste thickness gauge is a device that uses laser non-contact 3D scanning intensive sampling technology to measure the thickness, area and volume distribution of solder paste (red glue) printed on the PCB board. The equipment is widely used in the field of SMT production and is an important measuring equipment for controlling the printing quality of solder paste.
Usage
Measure the thickness of the printed solder paste, the average value, the highest and lowest result record. Area measurement, volume measurement, XY length and width measurement. Section analysis: height, highest point, cross-sectional area, distance measurement. 2D measurement: distance, rectangle, circle, ellipse, length and width, area, etc.
3D solder paste thickness gauge features
1. Laser measurement, solder paste measurement accuracy reaches nanometer level, effective resolution 56nm (0.056um)
2.2. High repetition accuracy (0.5um), small human error, high GRR
3. Digital image transmission: anti-interference, automatic error correction, high accuracy
4. High-resolution image acquisition: effective pixels up to 4 million color pixels
5. High sampling density: tens of thousands of points per square millimeter (6~20 sampling points per tin ball on average)
6. Multi-point substrate distortion correction function: it can not only correct the tilt, but also correct the distortion
7. Refer to the compensation function: eliminate the difference caused by solder resistance layer and copper foil thickness. 8. The program automatically runs and scans the whole board with one key. Up to thousands of pads can be measured per scan
9. Scanning automatically ADAPTS to substrate color and reflectivity, automatically corrects substrate tilt and distortion, and automatically identifies MARK
10. Large plate measurement: the scanning area can reach 350x430mm, and the length of the clamping substrate can exceed 860mm
11. Color gradient height mark, height ratio adjustable. 3D images rotate, pan and zoom in all directions. Display area panning and scaling
12.Xbar-R mean range control chart, distribution probability histogram, mean value, standard deviation, CPK and other common statistical parameters
These are the content Yangling Electronics mainly talking about, next time, Nancy will talk about the details of 3D solder paste inspection system. If you are interested in our products, please contact Nancy to make an offer for you. Thank you.
3D Solder Paste Thickness Tester/Inspection System in SMT Production Line
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